Automated Optical Critical Dimension Metrology System
The MicroLineTM 300 is a high-performance Critical Dimension Measurement System for wafers, masks, MEMS, and other micro-fabricated devices. This capable instrument provides precise automated field-of-view measurement of features ranging in size from 0.5µm to 400µm on wafers up to 200mm.
- 200 x 200mm Precision X-Y stage
- Vision-based autofocus for Optimum image quality
- Autoillumination Programmable light intensity
- Robust capacities for measuring transparent Layers, lines with irregular edges, thick films and more
- Fully Programmable Sequences including autofocus and Critical Dimension Measurement
- Motorized 6-Objective nosepiece with software control
- Optional transmitted illumination
Technical Specification：
- Stage Travel: 200 x 200 x 25mm (XYZ)
- Stage Type: crossed-roller with manual co-axial positioning and quick release
- Measurement Accuracy in the field of view: 0.010µm (with 100x objective lens)
- Feature size: 0.5µm - 400µm within the field of view
- FOV Measurement repeatability: <0.010µm on wafers (with 100x objective lens)
<0.005µm on photomasks (with 100x objective lens)
- Illumination: Quartz-halogen, reflected light, Autoillumination
- Low-noise CCD VGA format camera
- Image processing at 60 frames per second
Typical Applications for MicroLine 300 include：
- Wafers
- Photomasks
- MEMS
- Micro-scale components
Measurement Types:
1. Critical Dimensions:
Linewidth Linewidth
Pitch Pitch
Spacing Spacing
2. Overlay
Multi-layer registration
Box in box
Circle
Edge roughness
Butting error
